Custom Photonics & Electronics Assembly
Quick Turn Research Optical Modules: Mechanical, Electrical, Optical, Thermal
Custom low noise packaging for your Chips
Our Services
Photonic Packaging with Chip-to-Chip Alignment
Real-Time 1510-1590 nm imagery of waveguide to waveguide alignment. This is a tunable C-Band Evanescent Hybrid laser on Silicon waveguides inserting into a SiN Waveguide System. Our aligners step in 10 nanometer increments so aligning single mode waveguides is no problem.
Wirebonding
Gold Ball Bonding, Wedge bonding, & Ribbon Bonding down to 70 Micron Pitch. Here is an InP Tunable C-Band Laser with Integrated Semiconductor Optical Amplifiers and 12.5 Gbps integrated modulator wirebonded to a custom Flex circuit fabbed in 20 GHz Liquid Crystal Polymer Flex with 50 Ohm Termination Caps. All Designed and Assembled right here. We can also repair your worst wirebond nightmares, and wirebond components inches apart for your R&D testing
Die Attach
Eutectic Solder Die attach is done on a Finetech Lambda Bonder in the Nanofabrication center, and simple adhesive placements are done on our Westbond die bonder. Call ahead to check availability of collets and preforms for your job. These items can take two, to as long a 12 weeks to produce.
RELIABILITY PROGRAMS & eQUIPMENT
Self-contained Microenvironment Reliability Test systems for Telcordia Testing
- Telcordia Testing
- High Temperature Operating LIfe
- Reliable life determination
- Temperature Cycles
- Hot/Cold Soak
- Integrated optical & electrical test.
Coming Soon! Economical Low Noise Multi Channel Reliability Source-Measure units.
Up to 128 Channels per 3U rack unit, fully programmable SMUs for Reliability stress testing and automatic interim device interrogation. Micro amp source resolution, nano amp sense resolution to safely handle your most sensitive Germanium Waveguide Photodetectors.
Reliability Modelling using RELIASOFT
- Reliable Life Data Analysis
- Accelerated Life Testing
- System Reliability Block Diagrams, Fault Trees, and Simulation
- Reliability Prediction for Telcordia, MIL-217, etc.
Mechanical Design and Simulation
Mechanical Design using SOLIDWORKS 2018
Optoelectronic Package, Substrates, PCBs, Flex Circuits, Systems, Assembly Tooling, and Equipment. Here is a Soliton Comb-Locked Tunable C-Band Laser I put together with < 1 Hz Linewidth.
Thermal, Stress, & Deformation Analysis
Optoelectronic Package integrity, Thermal, and Heat Flow analysis.
Computational Fluid Dynamics
Thermal and pressure effects in fluid flows.
Meet the Team
Dave Kinghorn, President
32 years experience in product design, process development, manufacturing statistics, reliability program management, test, operations management, and Intellectual Property Development